The HT-T1D integrates with existing automated optical inspection workflows to provide deep-tissue visibility into glass substrates. While standard inspection tools often flag surface-level anomalies, this system reconstructs internal morphology and depth profiles, exposing defects introduced during laser drilling, etching, and metallization. Using visible-light holotomography, the device achieves a refractive-index sensitivity of 10⁻⁴, allowing engineers to track how specific defects propagate across successive process stages. This non-destructive approach replaces traditional failure analysis methods that often require destroying samples, cutting diagnostic timelines from weeks down to minutes.
Tomocube Debuts HT-T1D for 3D Glass Substrate Defect Analysis
Daejeon-based Tomocube has unveiled the HT-T1 Desktop, a holotomography system designed to identify internal micro-defects within glass substrates. By transitioning from destructive testing to non-destructive 3D visualization, the company aims to help semiconductor manufacturers accelerate yield learning and stabilize production lines for next-generation advanced packaging applications.
To manage the resulting data, Tomocube also launched its TomoAnalysis MI software platform. The tool processes 3D refractive-index volumes into actionable engineering reports, creating a unified workflow that bridges the gap between R&D investigation and production-line review. CEO YongKeun Park noted that the platform’s utility extends into glass photonic integrated substrates for co-packaged optics, where measuring refractive index is vital for device performance. As glass core substrates become increasingly standard for AI accelerators and high-bandwidth memory, Tomocube plans to leverage this technology to support system integration partners in scaling mass-production quality control.




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