The COMX-C710 utilizes the COM-HPC Client Size C form factor to pack significant processing power into a compact footprint. By integrating CPU, GPU, and NPU architectures on a single platform, the module achieves up to 126 TOPS of total AI performance. The inclusion of a 50 TOPS XDNA 2 NPU allows for specialized acceleration of AI inference tasks, such as object detection and complex scene understanding, while the GPU handles intensive multi-camera vision and SLAM processing.
ARBOR Debuts COMX-C710 Module with AMD Ryzen AI X100 Processing
San Francisco’s AMD Advancing AI 2026 conference served as the backdrop for ARBOR Technology Corp.’s unveiling of the COMX-C710, a next-generation COM-HPC module. Designed to push the boundaries of physical AI, the hardware leverages AMD’s latest Ryzen AI Embedded X100 Series to deliver high-performance computing for industrial and robotic systems.
Vincent Liao, VP of the Embedded Computing Product Division at ARBOR, noted that the platform simplifies system design by consolidating control, vision, and inference into a unified architecture. This integration is aimed at demanding sectors including autonomous mobile robots (AMRs), medical imaging, and industrial automation. To ensure reliability in these harsh environments, the module supports extended temperature ranges and wide voltage inputs, paired with LPDDR5x memory for increased data throughput and energy efficiency.
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