The shift toward larger panel-based manufacturing is accelerating as the semiconductor industry moves away from traditional 300 mm wafer constraints. By consolidating cleaning, etching, developing, and stripping into the Omni 310, 510, and 700 platforms, Manz Asia aims to simplify supply chains for manufacturers working with FOPLP, CoPoS, and Glass Core TGV technologies. This integrated approach is designed to reduce the complexity of managing multiple equipment vendors while providing the flexibility required for emerging high-performance computing applications.
Manz Asia Scales Panel-Level Packaging with New ECD Platform Series
As AI-driven chiplet architectures demand larger substrates, Manz Asia is rolling out its Omni platform series to bridge the gap between innovation and mass production. The new equipment supports 310 mm, 510 mm, and 700 mm panel formats, integrating electrochemical deposition and wet process tools to streamline complex RDL manufacturing.
Glass Core TGV manufacturing remains a specific focus for the company. Manz Asia has refined its etching and electrochemical deposition (ECD) tools to handle substrates as thin as 0.4 mm, achieving microvia dimensions down to 20 μm. With aspect ratios reaching 1:20, the equipment is engineered for void-free copper filling, a critical hurdle for ensuring structural reliability in next-generation packages. CEO Robert Lin noted that the company’s objective is to provide a unified portfolio that assists customers in moving rapidly from R&D to high-volume production, ultimately improving yield and cost performance across the board.
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