GSME and Teradyne Partner to Launch Silicon Valley Test Center

The facility will reside within GSME’s new 42,000-square-foot Silicon Valley headquarters, functioning as a dedicated floor equipped with Teradyne’s latest automated test platforms. By integrating GSME’s turnkey design capabilities with Teradyne’s hardware, the companies intend to provide a seamless bridge between initial device evaluation and full-scale production. This infrastructure will support pilot production, technical training, and engineering development for complex semiconductor applications.

Beyond the physical center, the agreement expands GSME’s global engineering footprint across the United States, Taiwan, Europe, and the Gulf Cooperation Council region. Farhat Jahangir, CEO of GSME, noted that standardizing on Teradyne platforms allows the firm to offer a more unified manufacturing enablement service. Shannon Poulin, President of Teradyne’s Semiconductor Test Group, emphasized that the partnership addresses the growing complexity of chip design, particularly for data center AI buildouts. Operations at the new headquarters are scheduled to begin in the fourth quarter of 2026.